Solder mask and circuits are very important in PCB manufacturing, providing electrical and mechanical protection while preventing short circuits and mis-soldering. We use the latest LDI laser exposure equipment for solder mask and circuits processing. Compared with CCD exposure machines, LDI exposure machines directly irradiate the photosensitive layer with laser beams to achieve ultra-high resolution. Meanwhile, its laser beam can be precisely controlled for superior exposure accuracy. In addition, direct laser exposure enables faster exposure speed. It eliminates the need for photolithographic films and masks, omitting the film production and alignment procedures. This simplifies the production process, cuts down manufacturing costs and shortens production cycles.

Lamination is a key process in the production of high-layer PCBs, which is critical to guaranteeing the quality and reliability of finished high-layer boards. We use the latest generation of fully automatic vacuum laminating machines, featuring more stable operation and superior lamination effect. Equipped with high precision, high stability and an advanced control system, these automatic laminators fully meet the requirements for stacking and laminating of high-layer boards.

To ensure more accurate and comprehensive defect inspection, we have implemented AVI systems in addition to AOI equipment during production. AOI finds defects based on optical scanning technology, while AVI performs inspection using high-resolution cameras and advanced image processing algorithms. By combining AOI and AVI inspection, we have further elevated the quality of high-layer designs, proactively identifying and correcting potential defects. This significantly improves the reliability and performance of our high-layer boards.